Overview
Electric Appliances

Tera Probe,Inc.

TeraProbe is a Japan-based outsourced semiconductor test (OSAT) company, a member of the Powertech Technology Inc. (PTI) group, specializing in wafer test and final test services for semiconductor manufacturers and fabless companies. The company handles a broad range of device types including logic, microcontrollers, image sensors, analog, and memory semiconductors, serving both domestic and international clients. TeraProbe differentiates itself through test development services—including test program development and probe card design—as well as turnkey back-end solutions offered in collaboration with PTI and other OSAT partners, with automotive-grade quality certification (IATF16949) at both its Japan and Taiwan facilities.

Market Cap
¥81.8B
US$522M
EV
¥132B
US$843M
Stock¥1,798▼-0.50%
US$1 = ¥156.80 (2026-10-23)
LTM EV/EBITDA
4.6
x
LTM EV/EBIT
8.9
x
LTM PER
17.1
x
LTM PBR
1.9
x
Stock vs TOPIX (1Y, base=100)vs TOPIX ▲+46.1%pt
1001
Oct 24, 25 – Oct 23, 26StockTOPIX
1Oct 15, 26US Sept CPI beat lifts yields, triggering AI/semiconductor stock selloff
MC → EV Bridge
81.8BUS$522MMarket Cap40.3BUS$257M+ Debt11.6BUS$74.0M− Cash0.00BUS$0.00M− Inv. Sec.21.7BUS$138M+ NCI132BUS$843MEV
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Performance & Balance
Revenue 5Y (¥B)
25.9US$165M'21/1233.2US$212M'22/1235.4US$226M'23/1237.1US$237M'24/1241.7US$266M'25/12
EBITDA 5Y (¥B)
14.2US$90.4M'21/1218.2US$116M'22/1219.6US$125M'23/1220.4US$130M'24/1222.7US$145M'25/12
Net Income 5Y (¥B)
1.79US$11.4M'21/123.13US$20.0M'22/124.09US$26.1M'23/123.51US$22.4M'24/123.37US$21.5M'25/12
Capital Structure
51%
49%
EquityD/E 0.95xDebt
Liquidity vs Debt 5Y (¥B)▼ Net Debt
CashInv. Sec.Debt
11.2US$71.6M19.5US$124M'21/1215.7US$100M20.9US$133M'22/1211.8US$75.2M14.1US$90.1M'23/1211.7US$74.6M13.8US$87.8M'24/1214.4US$91.7M29.1US$185M'25/12
Shareholders
Top 10 hold 74.0%
1
Powertech Technology Japan G.K.
48.81%
2
POWERTECH TECHNOLOGY INC. (Standing Proxy: Yoshinobu FUJIMOTO)
11.84%
3
Custody Bank of Japan, Ltd. (Trust Account)
4.71%
4
MSIP CLIENT SECURITIES (Standing Proxy: Morgan Stanley MUFG Securities Co., Ltd.)
1.55%
5
SBI SECURITIES Co., Ltd.
1.28%
6
The Master Trust Bank of Japan, Ltd. (Trust Account)
1.26%
7
BNYM SA/NV FOR BNYM FOR BNY GCM CLIENT ACCOUNTS M LSCB RD (Standing Proxy: MUFG Bank, Ltd.)
1.21%
8
MORGAN STANLEY & CO. LLC (Standing Proxy: Morgan Stanley MUFG Securities Co., Ltd.)
1.19%
9
Takayoshi HIIRO
1.06%
10
JP JPMSE LUX RE UBS AG LONDON BRANCH EQ CO (Standing Proxy: MUFG Bank, Ltd.)
1.05%
Management
8 officers
Takeshi YOKOYAMA
Director
Apr 1985 Joined Yamaguchi NEC Co., Ltd. Jul 2000 Joined Hiroshima NEC Co., Ltd. Apr 2004 Joined Hiroshima Elpida Memory, Inc. Jun 2005 General Manager, Wafer Measurement Department and Wafer Measurement Technology Department, Hiroshima Elpida Memory, Inc. Sep 2005 Director, the Company Apr 2007 Director and Executive Officer, CPO, the Company Feb 2010 Director and Executive Officer, General Manager, Memory Business Division, the Company Mar 2010 Director, TeraPower Technology Inc. Jun 2011 Director and Executive Officer, General Manager, Memory Business Unit, the Company Oct 2011 Director, Teramicros Inc. Jun 2012 Director and Executive Officer, COO, General Manager, Memory Business Unit, the Company May 2014 Director, Executive Officer, COO, General Manager, Memory Business Unit, and CSO & CM0, the Company Jun 2014 Director and Executive Officer, COO, General Manager, Memory Business Unit, the Company Jul 2015 Director and Executive Officer, COO, the Company Jun 2016 Director, Executive Vice President and COO, the Company Oct 2016 General Manager, Test Operation Business Unit, the Company Mar 2019 Director and Senior Executive Vice President, the Company Mar 2020 Director and Representative Executive President, the Company (current) Apr 2020 Director, TeraPower Technology Inc. (current) May 2025 Director, Japan OSAT Alliance General Incorporated Association (current)
1966-11-19
Yoichi KUROKI
Director
Apr 1995 Joined Yoshikawa Semiconductor Co., Ltd. Apr 1999 Seconded to Yoshikawa Electronics Engineering Co., Ltd. Aug 2006 Joined the Company Jul 2015 General Manager, Test Development Division, Off-Site Test Business Unit, the Company Jun 2016 General Manager, System LSI Test Development Division, Off-Site Test Business Unit, the Company Oct 2016 Head of No. 1 System LSI Development Center, Test Development Business Unit, the Company Mar 2020 Vice President (Technology Development), the Company Apr 2021 Vice President (Technology Development) and General Manager, System Engineering Department, the Company Sep 2022 Vice President (Technology Development), the Company Mar 2023 Director and Executive Officer (in charge of Technology Development), the Company (current)
1970-08-06
Tu-Kung TSAI
Director (Non-Executive), Nomination Committee Member
Jan 1999 Powertech Technology Inc., CEO & Chairman Sep 2005 the Company, Director Aug 2009 Powertech Holding (B.V.I.) Inc., Director (current) Sep 2009 PTI Technology (Singapore) Pte. Ltd., Director (current) Powertech Technology (Suzhou) Ltd., Director Apr 2012 Greatek Electronics Inc., Chairman Jul 2014 Powertech Technology (Singapore) Pte. Ltd., Director (current) Jan 2017 Powertech Technology Japan G.K., Designated Executive Officer (current) Jun 2017 the Company, Director (current) Jun 2018 Chicony Power Technology Co., Ltd., Independent Director Jun 2018 Compal Electronics Inc., Independent Director Nov 2018 Powertech Technology Inc., Chairman (current) Mar 2019 the Company, Nominating Committee Member (current) May 2021 Greatek Electronics Inc., Director (current) May 2024 Compal Electronics Inc., Independent Director (current)
1950-11-30
Yung-Ta HSIEH
Director (Non-Executive), Compensation Committee Member
Apr 1997 General Manager, Kingston Technology Far East Corp. Oct 2006 Vice President, Foxconn Electronics Inc. May 2010 Senior Vice President, Powertech Technology Inc. Oct 2010 President, Macrotech Technology Inc. Apr 2012 Director, Greatek Electronics Inc. (current) Jan 2013 Chief Executive Officer, Greatek Electronics Inc. May 2020 Director, Powertech Technology Inc. (current) Oct 2020 Chief Executive Officer, Powertech Technology Inc. (current) May 2021 Chairman, Greatek Electronics Inc. (current) Mar 2022 Director, the Company (current) Mar 2022 Compensation Committee Member, the Company (current) Nov 2022 Chairman and Director, Get-Team Tech Corporation (current) Nov 2024 Chairman and Director, TeraPower Technology Inc. (current)
1957-12-05
Chun-Hung SHEN
Director (Non-Executive), Audit Committee Member
Jul 1997 Manager, Taiwan Tea Corporation Oct 2002 CFO, Celxpert Energy Corporation Mar 2008 Senior Director, SYSTEX Corporation Nov 2011 CFO, Ichido Nov 2013 Assistant Vice President, Long Bon International Co., Ltd. Jan 2016 Deputy Director, Powertech Technology (Suzhou) Ltd. Feb 2018 Deputy Director, Powertech Technology Inc. Nov 2024 CFO, Powertech Technology Inc. (current) Nov 2024 Vice President, Powertech Technology Inc. Nov 2024 Director, Powertech Technology (Singapore) Pte. Ltd. (current) Nov 2024 Director, Powertech Semiconductor (Xi'an) Co., Ltd. (current) Mar 2025 Director, the Company (current) Mar 2025 Audit Committee Member, the Company (current)
1966-02-16
Koji IWAMA
Director (Non-Executive), Nomination Committee Member and Compensation Committee Member
Jun 2006 Executive Officer, Senior Managing Director, Vice President and General Manager of Sales, Toshiba Semiconductor Company, Toshiba Corporation Apr 2010 Executive Officer, Senior Managing Director and General Representative for Europe, Toshiba Corporation Jun 2012 Advisor, Toshiba Corporation Aug 2013 Advisor, Powertech Technology Inc. Jun 2017 Director, the Company Mar 2019 Outside Director, the Company (current) Mar 2019 Nomination Committee Member, the Company (current) Mar 2019 Compensation Committee Member, the Company (current)
1951-07-28
Naoki MORI
Director (Non-Executive), Nomination Committee Member and Audit Committee Member
Oct 2001 Registered as attorney-at-law; joined Kowa Sogo Law Office Oct 2005 Partner, Kowa Sogo Law Office Mar 2006 Established LM Law Office (currently LM Toranomon Minami Law Office); Partner (current) Oct 2009 Director, Professional Office, Enterprise Turnaround Initiative Corporation of Japan Aug 2011 Outside Audit & Supervisory Board Member, Corona Kogyo Co., Ltd. Jun 2012 Outside Audit & Supervisory Board Member, the Company Jun 2013 Outside Director, the Company Jun 2015 Outside Director, the Company (current) Director, Organization for Small & Medium Enterprises and Regional Innovation Japan (current) Mar 2019 Nomination Committee Member, the Company (current) Mar 2019 Audit Committee Member, the Company (current) Aug 2022 Representative Director, Topaz Regional Partners Inc. (current) Apr 2023 Outside Audit & Supervisory Board Member, Just Planning Co., Ltd. (current) Nov 2023 Representative Partner, NYH LLC (current)
1971-06-28
Michiari KONO
Director (Non-Executive), Audit Committee Member and Compensation Committee Member
Apr 1980 Joined Fujitsu Limited Jan 2003 Director, Integration Technology Department, Device Technology Division, LSI Business Group, Fujitsu Limited Dec 2007 Plant Manager, Mie Plant, Fujitsu Limited Jun 2009 Deputy General Manager, Back-End Manufacturing Division, Fujitsu Microelectronics Limited; Director, Fujitsu Integrated Microtechnology Limited; Director, Nantong Fujitsu Microelectronics Co., Ltd. Apr 2011 Executive Officer and Deputy General Head of Development and Manufacturing Division (Process and Packaging), Fujitsu Semiconductor Limited Jul 2013 President and Representative Director, Fujitsu Integrated Microtechnology Limited Sep 2014 Executive Officer and Deputy General Head of Management Promotion Division, General Head of Quality Assurance Division, and Deputy Head of Mie Foundry Company, Fujitsu Semiconductor Limited Dec 2014 Director and Managing Executive Officer, Mie Fujitsu Semiconductor Limited Apr 2016 President and Representative Director, Mie Fujitsu Semiconductor Limited Oct 2019 President and Representative Director, United Semiconductor Japan Co., Ltd. Mar 2024 Outside Director, the Company (current) Mar 2024 Audit Committee Member, the Company (current) Mar 2024 Compensation Committee Member, the Company (current) Supervisor, TeraPower Technology Inc. (current)
1957-06-28
Large Shareholding Reports
No filings
Disclosures
No disclosures
Primary Source Filings
EDINET
2026-08-14
Semi-Annual Securities Report
Period: Jan 2026 – Dec 2026
TDnet
2026-08-14
Q2 Earnings Flash
FY ending Dec 2026
TDnet
2026-05-15
Q1 Earnings Flash
FY ending Dec 2026
EDINET
2026-03-25
Annual Securities Report
Period: Jan 2025 – Dec 2025
TDnet
2025-11-14
Q3 Earnings Flash
FY ending Dec 2025
EDINET
2025-08-14
Semi-Annual Securities Report
Period: Jan 2025 – Dec 2025
TDnet
2025-05-15
Q1 Earnings Flash
FY ending Dec 2025
EDINET
2025-03-27
Annual Securities Report
Period: Jan 2024 – Dec 2024
EDINET
2024-08-14
Semi-Annual Securities Report
Period: Jan 2024 – Dec 2024
EDINET
2024-05-14
Quarterly Securities Report
Period: Jan 2024 – Mar 2024
EDINET
2024-03-28
Annual Securities Report
Period: Jan 2023 – Dec 2023
EDINET
2023-11-10
Quarterly Securities Report
Period: Jul 2023 – Sep 2023
EDINET
2023-08-10
Quarterly Securities Report
Period: Apr 2023 – Jun 2023
EDINET
2023-05-12
Quarterly Securities Report
Period: Jan 2023 – Mar 2023
EDINETAmended
2023-03-31
Amended Annual Securities Report
Period: Jan 2022 – Dec 2022
EDINET
2023-03-23
Annual Securities Report
Period: Jan 2022 – Dec 2022
EDINET
2022-11-10
Quarterly Securities Report
EDINET
2022-08-10
Quarterly Securities Report
EDINET
2022-05-13
Quarterly Securities Report
EDINET
2022-03-24
Annual Securities Report
EDINET
2021-11-12
Quarterly Securities Report
EDINET
2021-08-13
Quarterly Securities Report
EDINET
2021-05-14
Quarterly Securities Report
EDINET
2021-03-25
Annual Securities Report
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